Infotainment System for Porsche Car [from CAD, prototyping to finish]

[Nine8Six]

Originally Posted by algiorda

Thanks for the explanation Fred.

My pleasure And how come my GH4 is full WIFI and a full frame DSLR is not?! You need an upgrade soon my friend

Any questions or concerns, do ask guys.

Last update of the week: the kit comes with a door! A lid, cover, panel, whatever you call this thing... it comes with one. Modeling that door is a good sign fellas... we are getting near(er) the manufacturing phase. Just need a heatsink(+CFD), and a frame for the IPS display and off it goes in the machines! The easy bits (hrrr finally)

(off to the river with the 2 dogs, wife and friends for the whole weekend guys - 4hrs driving starting 6am in the morning. Lets catch up next week, have a good one fellas!)


^ poor quality render, apologies. Ran this in less that 10min. Good visual none the less

[Nine8Six]

^ All very fancy pics, does it work?!

What a weekend. The dogs kept on barking randomly at some night critters the whole of Saturday night so most of us didn’t get sleep. Well, I did LOL but the others hardly slept (oops!). We stayed in 5* tents, of course (camping!).

Oh well. We came back at lunch time so I am already upstairs in my office carrying on the design validations (CFD) on our assembly while the wife and my puppies are catching up some good sleep. I am only doing flow atm… pointless to include coupled thermal at this stage, all we need to know for now is whether the heatsink I’ve designed a few hour ago is getting an ‘effective’ flow of fresh air.




^ Omitted in previous screen grabs is the front of the assembly. Nothing to show really… other than the frame that caps off (seal) the whole enclosure. That frame is modeled to accommodate both the IPS display & capacitive touch screen (sandwiched together).




^ Using a straight ‘fin’ system for our heatsink here. The whole idea was to get fresh air flowing between the fins with very little resistance/drag. Pins are also very effective, however in a design like ours, they would simply create excessive turbulence. So for us, fins are the most effective way.




^ Above is our fluid domain. It is the core fluid from our sealed assembly. Essential step to all CFD analisys. Inserting this pic because those fluid domain are quite difficult to extract. This is accurate to 0.2mm.




^ The-End-of-the-world here. Preliminary CFD on our design/assembly fails huge. As you can see from the grab above, we are not getting a ‘flow’ on the heatsink. We are surely getting so air (air is air) but not effective at all. My intention of having a inlet and outlet positioned the way they are now was a good one but results are not satisfactory.



^ Oh hang on, we are actually getting 'some' air (air is air!), but nothing like what I was aiming for. That is so NOT going to cool down my CPU and GPU, pretty useless in fact. Don't even bother doing thermal validation with this LOLL

So at that stage, we might as well just buy those $200 Asian (Android?) 2DIN kits. Those aren’t professionally thermally managed and often heat up to 90~100degree Celsius on a good summer day (I’ve heard/read a few weeks ago only).

The other option is to stop crying and fix our design by blocking where the air likes to go and channel ALL of it onto-our-heatsink! Sounds easy but let's see lollll I’ll get this done in a few hours and re-run the validations. This does NOT go into my machines for prod if no proven thermal management comes out before lollll

I'll update later this eve

[Nine8Six]

Bingo! We got it. All it needed was closing the top and bottom cabling trays (circled in red below). Thank god I took my time and didn't do the Electrical Routing before CFD, I would have had to run these wires all over again.

So there we have it. Every cubes of air is assigned to cooling the unit, no lost. Now if you ask me, this is the part where I get really exited in manufacturing this assembly. As long as I know this will work out as planed, I'm happy to trow the rest of the energy it needs for project completion. Goes fast from here

I'll run the thermal analysis this week, although not sure I'll upload as many visuals. Wouldn't want to bore anyone. Besides I am still waiting for a member to say "Hey, this is a CAR forum" lollll Pushing my luck with all this technical stuff



^ In red are are the two areas that needed closing, so to channel ALL of the air between those fins. Bye bye cabling trays however, can;t have it all!




^ Our updated fluid domain. Notice the 3 openings to let the hot air evacuate the central PCB area. This is done with a slight negative pressure




^ More than happy with this consistent flow. In fact, it performs far better than what I was hoping for (see for yourself in below grabs). Super exited about this. Hard work paying off, finally




^ Top view




^ View from the side




^ And finally, with some of the layers turned ON... so you guys can visualize what's happening in there

Enjoy!